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The space bit of SpaceX is worth $8 a share, says Morgan Stanley
The social physics of conversation: Communication patterns matter
Hackers can use 9 of the most popular AI tools to assemble massive botnets
"HalluSquatting" weaponizes LLMs' inability to say "I don't know."
Why HDI PCB Manufacturing Starts Long Before the First Hole Is Drilled
Why HDI PCB Manufacturing Starts Long Before the First Hole Is Drilled When people think about PCB manufacturing, they usually imagine drilling, plating, imaging, etching, solder mask, and surface finishing. For conventional PCBs, that assumption isn't too far from reality. For HDI (High Density Interconnect) PCBs, however, manufacturing actually begins long before any physical production starts. The success of an HDI project is often determined during engineering review rather than on the factory floor. Manufacturing Starts with Design Decisions A PCB layout may pass every design rule check inside CAD software while still being difficult to manufacture efficiently. Typical examples include: unnecessary stacked microvias excessive sequential lamination extremely aggressive trace and space dimensions unrealistic copper balancing inefficient stack-up planning None of these issues are fabrication defects. They are engineering decisions. The earlier they are identified, the lower the overall project cost becomes. The Stack-Up Is More Important Than Many Engineers Expect One of the biggest misconceptions is that increasing the layer count automatically solves routing problems. In reality, a carefully planned stack-up usually provides greater benefits than simply adding more copper layers. A good stack-up improves: signal integrity impedance consistency EMI performance power distribution thermal behavior More importantly, it creates a PCB that is easier to manufacture repeatedly with stable quality. HDI Is a Balance Between Performance and Manufacturability Many first-time HDI designs focus only on routing density. Experienced engineers usually focus on manufacturability. For example: Should this microvia really be stacked? Can staggered vias achieve the same result? Is another lamination cycle actually necessary? Can the BGA fan-out be optimized differently? Each decision influences fabrication complexity, yield, lead time, and production cost. Why DFM Matters More for H
GitLost: We Tricked GitHub's AI Agent into Leaking Private Repos
The Lindy effect in software
GPT-5.6 Sol, along with Terra and Luna, will launch publicly this Thursday
How to Build a Minimal ZFS NAS Without Synology, QNAP, TrueNAS (2024)
Understanding the Go Runtime: Profiling
Half of Americans struggle to afford groceries and gas, exclusive poll finds
So you want to learn physics (second edition, 2021)
Maine librarians are helping patrons resist AI and Big Tech
Copy That Floppy – Cambridge guide for preserving data from fragile floppy disks
Protobuf-py: Protobuf for Python, without compromises
How America's Wealth Distribution Has Changed Since 1989
AI has taken over the stock market. The bond market is next
Is The Economist Always Wrong?
Ask HN: Best Podcasts of 2026 [So Far]
Trying to diversify what I listen to and interested to hear what everyone else is enjoying this year!